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Siemens SEWC Hardware Engineer_IPC 西门子自动化 硬件开发工程师_IPC

CHENGDU, China
Research & Development

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English (UK)

Job Description

Mission:

IPC HW SPL, the sub-team leader of HW team, drives and implements the development of IPC HW system with up-to-date technology quality-effectively and cost-effectively on time.

What are my responsibilities?

To be lead role of IPC HW sub-team for the IPC HW development (Electronic), the responsibilities includes but not limited to

Controlling, coordinating, cooperating and advising the technical realization of work packages of PC HW sub-team (including adherence to schedule).

Defining the IPC features and solution, providing HW development effort and plan, implementing and qualifying the design work package, manufacturing introduction and maintained.

What do I need to qualify for this job?

Bachelor or above, >5 years HW development; preferred if experienced in Motherboard development of PC, IPC and notebook.

Capable to cooperate and lead in an diverse, international environment.

Knowledge of PC Architecture, especially Intel x86 platform.

Experience in Motherboard development.

Knowledge of digital and Analog circuitry.

Knowledge about the power solution of motherboard.

Knowledge about ATX and Flex power supply.

Knowledge of signal integrity design for high-speed signal and bus (DDR, PCIe, LVDS/eDP, SATA and USB etc.), Circuit

test/Debug, EMC Design and EMC test/Debug.

Knowledge and experiences in spec and protocol of LPC, UART, SMBus, I2C, PCIe, eDP and USB.

Some experiences in BIOS function and OS test.

Some experiences in LCD and touch controller design and test.

Knowledge about HW- development process.

Oragnization and planning.

Task and time management.

English.


Job ID: 104149

Organization: Digital Industries

Experience Level: Experienced Professional

Job Type: Full-time





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