Process Engineer

Job Description

Department -  Technical Competency  Center -02  Bonding Technology
Qualification - BE Electronics ( 4-5 Years of Experience ) or Diploma in Electronics ( 7-8 Years of Experience)

Skills/Knowledge Required

1. SMT Process (  Screen Printer , Solder paste inspection ,Pick and place )
        2. Reflow Process
        3. Wave soldering Process
        4. Conformal Coating  process
        5. Problem Solving Technique.
        6. Good Communication Skill 
        7. Fixture Development knowledge.
       
       Job Responsibilities 

1.Ordering Stencil and Verification of the Stencil.
2.Creating The Solder paste printer program.
3.Optimization of the program and releasing the control parameter sheet.
4.Creating Reflow Profile.
5.Optimization of the reflow solder  program and releasing the control parameter sheet.
6. THT component forming details .
7.Creating Wave soldering program.
8.Wave solder Profiling .
9.Optimization of the Wave solder  program and releasing the control parameter sheet.
10.Ordering Wave solder pallet and verification
11. X-Ray inspection of NPI PCBA'S.
12. Taking CAPA for major SMT & THT soldering related  process issues.

13. ISO documentation 

        14. Cost reduction , improvement projects to be handled.

Job ID: 191526

Organization: Smart Infrastructure

Company: Siemens Ltd.

Experience Level: Experienced Professional

Job Type: Full-time

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